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iPhone 7 7P A10 lower Baseband CPU WIFI tin plate steel BGA reballing Solder template
| Price: | 0.99 USD |
| Payment Terms: | T/T,L/C,D/A,D/P,WU,Paypal,Money Gram |
| Place of Origin: | Guangdong, China (Mainland) |
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Product Detail
Model No.:
VC574
Production Capacity:
10000
Brand Name:
vipprog
Means of Transport:
Air
Delivery Date:
3-5days
iPhone 7 7P BGA Reballing Stencil dedicate kit, iphone7 7P A10 lower Baseband CPU heating Reball Tool
iPhone 7 7P BGA Reballing Stencil dedicate kit, iphone7 7P A10 lower Baseband CPU heating Reball Tool, Ball Soldering Net Stainless Steel Plate for iphone 7 7 plus A10 lower Baseband CPU WIF.
iPhone 7 7P A10 lower Baseband CPU WIFI tin plate steel
[ Optional ]:
Optional 1: K01 A10 CPU
Optional 2: K02 Baseband CPU
Optional 3: K03 WIFI
Optional 4: K04 Big Power IC
Optional 5: K06 Small Power IC
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Company Info
vipprog tech [China (Mainland)]
Business Type:Manufacturer, Trading Company
City: Guangzhou
Province/State: Guangdong
Country/Region: China (Mainland)
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