10 in 1 graver tool and disassembly tool Set for iPhone A9 A8 A7 A6 A5 A4 Main Logic Board BGA Chip, Proffesional  iPhone A9 A8 A7 remove repair tool set for iPhone CPU disassemble

10 in 1 iPhone A9 A8 A7 CPU BGA chip graver tool and disassembly tool

[Optional Type]:

Optional 1: One handle and 10 pcs blades in different shape

Optional 2: 10pcs handle and 10 pcs blades in different shape

 For BGA repair, dismantling phone CPU chip and phone repair
 It can be used to separate the welding spot
The ultra thin blade is made of alloy steel,which is good toughness, high temperature resistant, no deformation and hard-wearing disassembling
All-metal handle is equipped with a high temperature resistant tip which can clamp the blade tightly, bring a comfortable use feeling to users

Instructions:

  1: to clean the knife edge position when the demolition glue chip and chip temperature around 200 Vinyl
 
  2: hot air gun to open 150 degrees, 60 pairs of large air speed for 2 minutes to warm up the motherboard
 
  3: Hot air gun put a small head, a temperature of 350 degrees to open the first blow of the knife position about 10 seconds and then shake inserted into the bottom of the chip.