WL 0.1mm BGA reballing Solder template stencil for iphone Baseband NAND A10 A9 A8 CPU, Ball Soldering Net Stainless Steel for iphone 5/5s  6/6p 6s/6sp 7/7p Baseband and NAND Chip, A6 A7 A8 A9 A10 CPU

WL 0.1mm BGA Reballing Stencil for iphone Baseband NAND A10 A9 A8 CPU

[ Optional BGA Reballing Stencil Package ]:
Optional 1: iphone 5/5s Baseband and NAND
Optional 2: iphone 6/6p Baseband and NAND
Optional 3: iphone 6s/6sp Baseband and NAND
Optional 4: iphone 7/7p Baseband and NAND
Optional 5: A6 CPU upper
Optional 6: A7 CPU upper
Optional 7: A6/A7 CPU Lower
Optional 8: A8 CPU upper
Optional 9: A8 CPU lower
Optional 10: A9 CPU upper
Optional 11: A9 CPU lower
Optional 12: A10 CPU lower

[ Optional  Aluminum Mould Base ]:  it is universal, can fit with any Black Positioning Mold,

1: Included base
2: Without base

Optional Positioning Mold (Black): Not univeral, can't working with different BGA Reballing Stencil, need the right model BGA Reballing Stencil, the Black Positioning Mold just match with the right BGA Reballing Stencil.

1: Included Positioning Mold
2: Without Positioning Mold

there have 3 parts section,  BGA Reballing Stencil + Positioning Mold (Black)  + Universal Aluminum Mold Base (Golden)

just the BGA Reballing Stencil

BGA Reballing Stencil  + Black Positioning Mold

Full Set: BGA Reballing Stencil + Positioning Mold (Black)  + Universal Aluminum Mold Base (Golden)

0.1-0.12mm thickness, high hardness, hardly deformed,  increase the success rate on BGA reballing Solder working, it is the  top quality BGA Reballing Stencil  for iphone Baseband CPU and NAND, A10 / A9 / A8 CPU..

WL Top quality Fast Speed BGA reballing Solder template stencil