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BGA Reballing Stencil Template Tin net for iphone A10/A9/A8 CPU 

Price: 4.99 USD 
Payment Terms: T/T,L/C,D/A,D/P,WU,Paypal,Money Gram 
Place of Origin: Guangdong, China (Mainland) 
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Product Detail

Model No.: VC713
Production Capacity: 10000
Brand Name: vipprog
Means of Transport: Air
Delivery Date: 3-5days

2017 New patent products: prevent convex BGA Reballing Tin net, iphone A10/A9/A8 CPU BGA Reballing Stencil Template Tin net

2017 New patent products:  prevent convex BGA Reballing Tin net, iphone A10/A9/A8 CPU BGA Reballing Stencil Template Tin net, BGA Reball Reballing Stencil Template with ventilation hole, it will supply the heat radiation function, with many thermal via louver, and prevent bulges and avoid hump on the BGA Reballing Stencil Template.


0.12MM BGA Reballing Stencil Template Tin net for iphone A10/A9/A8 CPU


[ Optional ]:
Optional 1:  A8 upper
Optional 2:  A8 lower
Optional 3:  A9 upper
Optional 4:  A9 lower
Optional 5:  A10 lower


With ventilation hole,  prevent bulges and avoid hump, it is the prevent bulges BGA Reballing Stencil Template with ventilation hole.


Features:

1: with Cooling hole design, prevent bulges and avoid hump

2: Top quality Steel sheet material, Not easily deformed

3:  smooth wall of hole, easy to doing BGA Reballing



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 Mr. hui yong

Tel: 86-0755-29438108
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Company Info

vipprog tech [China (Mainland)]


Business Type:Manufacturer, Trading Company
City: Guangzhou
Province/State: Guangdong
Country/Region: China (Mainland)

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